Polyamide Adhesives

Say polyamide adhesive so manunan teknolohiya ed benegan na TH-9150 tan TH-9180, duaran atagey a -performance hot-melt ya pormulasyon ya ginawa parad sankairapan ya angat ed panagtipon na luluganan tan elektroniko. Say TH-9150 et onlelemek ed 150 degree, bangta say TH-9180 et onlaknab na thermal capability to ed 180 degree; parehon grado so niiter bilang pareparehon andeket a pellets ya maples ya natunaw ed sakey a pluido ya abeba so viscosity to, balet ta nawalaan na tampol ya biskeg parad maples ya panangasikaso tan antikey a panaon na siklo. Saray resin et 100% ya solido, RoHS/REACH compliant tan anggapoy VOCs ya ipapaway da, kanian saray manggagawa et malinis tan makatulong ed saray trabahador ya alternatibo ed solvent odino reactive chemistries.

Diad loob na luluganan, say polyamide adhesive family et manggagawa na istruktural, vibration-damped bonds ed baetan na nanduruman substrate ya uusaren ed saray dashboard, door card, headliner tan seat shells. Manbabasa tan man-angkla itan ed PP, ABS, PC, PA, SMC, aluminum ya anggapoy malaknab ya pretreatment, ya mansiasiansia na inka-elastiko manlapud –40℃ya anggad mas atagey nen say temperatura na cabin. Say TH-9180 et nibaga parad saray aplikasyon na makina-compartment-air-cleaner housing, powertrain covers, sensor brackets-no iner say andukey ya pakawalaan na 150℃ya dagem, ATF, larak na motor tan asin ed karsada et maneral ed saray tradisyonal ya olefinic melt odino EVA melts. Say hydrophobic backbone to et ag makaloob na danum, kanian say biskeg na bond tan say dimensional stability et ag manguuman kayari na 1000 h SAE J2196 immersion tests.

Diad labas na laman na kotse, say parehon polyamide adhesive chemistry et mankikimey bilang low-pressure molding compound parad electronic encapsulation. No painitan ed 180-220℃tan i-inject ed 3-15 bar, say TH-9150 tan TH-9180 et onaagus a kalmado ed kaliberliber na saray mainomay ya naderal ya PCB, solder joints, connectors tan pino-pitch sensors, ya onlelereg ed loob na pigaran segundo pian manporma na IP68{17}}rated shell. Say resulta na encapsulant et mangiiter na 20 kV mm⁻¹ dielectric strength, –40℃anggad 150℃thermal cycling tolerance, tan 30 % ya elongation ya makasesepsep na mechanical shock ya ag-onkakapuy. Kanian saray managgaway harness et mangaagamil ed saya bilang sakey a kasandi na multi-step epoxy potting odino over-molding, ya mamapaabeba ed gastos ed trabaho legan ya mamapeles na throughput.

Parehon grado so nisuplay ed moisture-proof, 25 kg ya bag ya nayarin ipasen ya direkta ed estandarten hot-melt tanks odino low-pressure molding machines. Say pangisimpen ed temperatura na kuarto et mamasiansia ed performance ed loob na ag-onkulang ed duaran taon, ya mamaandi ed gastos ed cold-chain. Balanglan say kimey et say pangipeket ed saray exterior trim clips diad tindaan na pintura odino say pangiseal na battery-management electronics ed aralem na power-pack, say TH-9150 tan TH-9180 polyamide adhesive systems so mangiiter ed saray automotive tan electronics OEMs na mas berde tan mas andukey ya kolor ya napanmatalkan.

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